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Capacitive Discontinuities & Your Return Loss Performance…

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Jitesh Shah Uncategorized January 25, 2019June 16, 2019

When Not To Use TSVs…

when_not_to_use_tsvs_12_31_2018Download
Jitesh Shah Uncategorized December 31, 2018June 16, 2019

Improving DDR Performance by Switching from Wirebond to Flip Chip…

improving_ddr_performance_by_switching_from_wb_to_fc_embedded_computing_oct_2012Download
Jitesh Shah Uncategorized October 1, 2012June 16, 2019

Estimating BondWire Current Carrying Capacity…

estimating_bondwire_current_carrying_capacity_7_15_2012Download
Jitesh Shah Uncategorized July 15, 2012June 5, 2019

Thermal Considerations In Package Design & Selection…

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Jitesh Shah Uncategorized September 28, 2010June 16, 2019

Performance Comparison of Gold vs. Copper Wirebonding…

performance-comparison-of-gold-vs.-copper-wire-bonding_10_01_2009Download

Jitesh Shah Uncategorized October 1, 2009June 5, 2019

Floorplanning a Power Delivery Network using Spice…

floorplanning-a-power-delivery-network-using-spice_7_24_2008Download
Jitesh Shah Uncategorized July 24, 2008June 5, 2019

Overcoming Performance Bottlenecks with Embedded Active Chips…

overcoming-performance-bottlenecks-with-embedded-active-chips_5_1_2008Download

Jitesh Shah Uncategorized May 1, 2008June 5, 2019
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